Purchasing (Based on a world-wide
supplier network)
printed circuit boards
electronic components
mechanical components
or provided by customer
Hardware and software development
analog and digital circuits
microprocessor circuits
product maintencance
Design
CAD pcb layout
establishment of drawings and part lists
device design
Production
ESD-compliant storage and production
in-house PP system
components tracking
Solder paste application
automatic screen printer
Assembly
conventional assembly methods
SMD one-sided and two-sided
mixed assembly
Processing of SMD components
all SMD including BGA, µBGA, CSP
and flip-chip
smallest component for automatic assembly:
biggest component for automatic assembly (mm):
smallest assembly pitch (mm):
placement accuracy:
working out of pcb layouts
working out and processing of Gerber data
working out of drawings
scanning and processing of drawings
Automatic screen printing for
soldering paste application
maximum size of pcb 350 x 400 mm
adjustable repeating accuracy up to 5µm
Vapour phase soldering machine
useable soldering surface max. 320 x 520 mm
soldering temperature 230°C
uniform temperature distribution over the complete subassembly
overheating of the components is excluded
100% protective atmosphere due to inert vapour
Double-shaft soldering machine (RoHS compliant and non RoHS compliant)
shaft width 400 mm max.
Automatic SMD assembly (Mydata
MY12)
max. assembly surface 450 x 550 mm
average assembly speed approx. 4000 components/h
electric measuring of resistances, condensators, diodes, and transistors
during the assembly
Manual assembly workplaces
Visual inspection workplaces
illuminated magnifying glasses and magnifying
microscopes
x-ray inspector
AOI
PC-supported inspection workplaces
for comparisons, intermediate and final inspections